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英国365集团官网新科明毅电子FPC填孔电镀装备，专为AI高阶软板填孔制程打造
Date: 2026-07-20　Click: 2596




陪同智能手机向端侧AI等偏向升级，高阶FPC手艺要求一连攀升，生产制备工艺正沿着更高厚径比的偏向快速演进。



在这一趋势下，FPC的厚径比需求逐步抬升，古板填孔电镀工艺的孔内填充质量与量产良率遭遇显著瓶颈，难以知足高阶FPC生产需求。




面临这一瓶颈，明毅电子自主研发的 FPC 填孔电镀装备——接纳片式笔直一连电镀工艺，搭载高喷流手艺，可适配高阶软板填孔制程。


365英国上市(集团)有限公司-Official website


相比古板工艺计划，该装备以更高厚径比的填孔能力、更优的面铜匀称性、更可靠的薄板走板体现与更高的生产良率，可知足 AI 手机等终端对高阶软板的量产需求。




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  • Ningmei Tech

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